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RL78/G1A CHAPTER 29 ELECTRICAL SPECIFICATIONS (T
A = −40 to +85°C)
R01UH0305EJ0200 Rev.2.00 860
Jul 04, 2013
Notes 1. Total current flowing into VDD and EVDD0, including the input leakage current flowing when the level of the input
pin is fixed to VDD, EVDD0 or VSS, EVSS0. The values below the MAX. column include the peripheral operation
current. However, not including the current flowing into the A/D converter, LVD circuit, I/O port, on-chip pull-
up/pull-down resistors, and data flash rewriting.
2. When high-speed on-chip oscillator and subsystem clock are stopped.
3. When high-speed system clock and subsystem clock are stopped.
4. When high-speed on-chip oscillator and high-speed system clock are stopped. When setting ultra-low power
consumption oscillation (AMPHS1 = 1). Not including the current flowing into the RTC, 12-bit interval timer and
watchdog timer
5. Relationship between operation voltage width, operation frequency of CPU and operation mode is as below.
HS (high-speed main) mode: V
DD = 2.7 V to 3.6 V@1 MHz to 32 MHz
V
DD = 2.4 V to 3.6 V@1 MHz to 16 MHz
LS (low-speed main) mode: V
DD = 1.8 V to 3.6 V@1 MHz to 8 MHz
LV (Low-voltage main) mode: VDD = 1.6 V to 3.6 V@1 MHz to 4 MHz
Remarks 1. f
MX: High-speed system clock frequency (X1 clock oscillation frequency or external main system clock
frequency)
2. f
IH: High-speed on-chip oscillator clock frequency
3. f
SUB: Subsystem clock frequency (XT1 clock oscillation frequency)
4. Except subsystem clock operation, temperature condition of the TYP. value is TA = 25°C