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60 Chapter 1 Introduction to the Business Communications Manager Platform Hardware
P0993133 03
• PEC IIIs — The Business Communications Manager 3.0 uses PEC IIIs to deliver increased
capacity for digital signal processing for voice mail, call center, FAX, VoIP trunks, IP
telephony, and dialup ISDN WAN. The BCM200 platform uses one PEC III card (expandable
to 2). The BCM400 platform uses two PEC IIIs (expandable to 4) to accommodate increased
requirements for media processing. Refer to the chapter on configuring MSC Resources in the
Business Communications Manager 3.0 Programming Operations Guide.
Main card
The main card contains several field replaceable units (FRUs) such as the RAM, modem card and
CMOS battery. A riser card, set at right angles to the main card, provides connections for the MSC
and field installed wide area network card. In North America only, an embedded modem provides
connection for a backup analog trunk. Figure 20 shows the layout of the main card as installed in
the base function tray.
The main card contains the following hardware:
•1 x Processor
• 1 x 168-pin 256MB DIMM (maximum of 2 x 256MB DIMMS)
• 1 x modem card (North American system only)
• 1 x lithium coin battery cell (CMOS)
• 1 x 2-slot PCI riser card
Figure 20 Main card connectors
PCI Riser
card
connectors
Modem
card
Main card
DIMM
connectors
I/O card
connector
CMOS
battery