Filter
Top Products
238
1745D–ATARM–04-Nov-05
AT91M55800A
25. Soldering Profile
25.1 Green Package Soldering Profile
Table 25-1 gives the recommended soldering profile from J-STD-020C.
Note: The package is certified to be backward compatible with Pb/Sn soldering profile.
A maximum of three reflow passes is allowed per component.
25.2 RoHS Package Soldering Profile
Table 25-2 gives the recommended soldering profile from J-STD-20C.
Note: It is recomended to apply a soldering temperature higher than 250°C.
A maximum of three reflow passes is allowed per component.
Table 25-1. Soldering Profile Green Compliant Package
Profile Feature Green Package
Average Ramp-up Rate (217°C to Peak) 3°C/sec. max.
Preheat Temperature 175°C ±25°C 180 sec. max.
Temperature Maintained Above 217°C 60 sec. to 150 sec.
Time within 5°C of Actual Peak Temperature 20 sec. to 40 sec.
Peak Temperature Range 260 +0 °C
Ramp-down Rate 6°C/sec. max.
Time 25°C to Peak Temperature 8 min. max.
Table 25-2. Soldering Profile RoHS Compliant Package
Profile Feature Convection or IR/Convection
Average Ramp-up Rate (183°C to Peak) 3°C/sec. max.
Preheat Temperature 125°C ±25°C 180 sec. max
Temperature Maintained Above 183°C 60 sec. to 150 sec.
Time within 5°C of Actual Peak Temperature 20 sec. to 40 sec.
Peak Temperature Range 260 + 0°C
Ramp-down Rate 6°C/sec.
Time 25°C to Peak Temperature 8 min. max