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1745D–ATARM–04-Nov-05
AT91M55800A
Figure 24-2. 176-ball Ball Grid Array Package Drawing
Table 24-4. Device and 176-ball BGA Package Maximum Weight
606 mg
Notes: 1. Package dimensions conform to
JEDEC MO-205
2. Dimensioning and tolerancing per
ASME Y14.5M-1994
3. All dimensions in mm
4. Solder Ball position designation
per JESD 95-1, SPP-010
5. Primary datum Z and seating
plane are defined by the spherical
crowns of the solder balls
Symbol Maximum
aaa 0.1
bbb 0.1
ddd 0.1
eee 0.03
fff 0.04
ggg 0.03
hhh 0.1
kkk 0.1
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