Huawei MC509 CDMA LGA Wireless Office Headset User Manual


 
错误!未知的文档属性名称
Hardware Guide
Mechanical Specifications
Issue 01 (2011-04-08)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
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Figure 6-3 Nameplate
The picture mentioned above is only for reference.
Make the film according to the drawing.
The silk-screen should be clear, without burrs, and dimension should be accurate.
This nameplate should not be covered by the film.
The material and surface finishing and coatings which used have to make satisfied with the
EU WEEE and RoHS directives.
The label must be heated up for 20s~40s and able to endure the high temperature of
260 °C . And the color of the material of the nameplate cant change.
6.5 Packing System
HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum
packing into cartons. To get the details about the packing system, please refer to
HUAWEI LGA Module Technical Guide for Assembly.