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SP200/210 Maxon SP200/210 Radio
Issue 1.0 SPARE PARTS & MAINTENANCE POLICY
03/01 Page 10-3
Surface mounted integrated circuit
replacement
Soldering and de-soldering techniques of the
surface mounted IC’s are similar to the
above outlined procedures for the surface
mounted chip components.
Use extreme care and observe static
precautions when removing or replacing the
defective (or suspect) IC’s. This will prevent
any damage to the printed circuit board or
the surrounding circuitry.
The hot-air soldering system is the best
method of replacing surface mount IC’s. The
IC’s can -easily be removed and installed
using the hot-air system. See the
manufacturer’s instructions for complete
details on tip selection and other operating
instructions unique to your system.
If a hot-air systems is not available, the
service technician may wish to clip the pins
near the body of the defective IC and remove
it. The pins can then be removed from the
PCB with a standard iron and tweezers, and
the new IC installed following the Surface
Mount Component Replacement procedures.
Provided that the IC is relatively new, It will
not be necessary to ‘tin’, all (or any) of the IC
pins before the installation process.
If the IC has been in stock for some time,
cleaning, and tinning of the pins may be
necessary.