Integrated System in Board is a type of SiP (system in package) technology, and is a module technology that achieves high
densities and thinner form factors by using SANYO's unique substrate and mounting technologies. The Integrated System in
Board lineup consists of three types of process: ISB-Solo, ISB-Duo, and ISB-Quad. Which process is used is selected based on
the application.
In addition to standard products, customer specified circuit blocks can also be converted to Integrated System in Board using an
optimal process, thus creating a new module device in a short time.
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Integrated System in Board
Integrated System in Board
● Thickness of only 0.45 mm (0.65 mm if resistors are included) realizes excellent thermal radiation and
short development TAT
● Optimal for SiP implementation of small-scale block that includes semi-power semiconductors.
● Adopts unique SANYO-developed 0.2 mm thickness high-density substrate (2 layers)
Line 40
µm / Space 40 µm at 25 µm thickness copper foil,
Via diameter 100 µm / Via land diameter 150 µm
● Thickness of only 0.53 mm (0.73 mm if resistors are included) realizes high-density mounting
● Optimal for SiP implementation of high-frequency (up to 10 GHz) blocks, blocks that require
performance or EMC workarounds based on component placement/wiring pattern, and blocks that
require partial high-density mounting.
●Adopts unique SANYO-developed 0.24 mm thickness high-density substrate (4 layers)
●Thickness of only 0.6 mm realizes high-density mounting
●Optimal for SiP implementation of high-frequency (up to 10 GHz) blocks, blocks that require performance
or EMC workarounds based on component placement /wiring pattern, and subsystems that require high-
density mounting.
●Chip-on-Board type
■ Assembly structure examples
■ Application example (Cell phone charger circuit block)
■ Application example (Clock detector block)
■ Assembly structure examples
■ Assembly structure examples
● Reduced wiring area due to implementation as miniature modules
● Integration of noise reducing components
● Supply voltage stabilization by using dedicated layers for power supply and ground
Integrated System in Board Process Lineup
ISB-Solo
ISB-Duo
ISB-Quad
Noise suppression effect (measured)
Heat dissipation effect (simulation)
Module technologies that achieve high-density and thinner form factors
SANYO Original technology
■ Evaluation results using a microcontroller and SRAM
(Surface probe method - 30 MHz to 1 GHz)